1459827507-c5bed0e2-3705-474f-9c78-7da8d3555548

The present invention provides methods and devices for enabling communication between a mobile device and Universal Plug and Play devices. The photodetector portion includes a p-type first impurity region formed in the semiconductor substrate and an n-type second impurity region formed below the surface inversion layer. The first output of electrons can be contacted with a target to provide a first beam of x-rays. The first conductive layer is transparent.