A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. To change the physical negotiable instrument to a non-negotiable instrument, a bank or other financial institution may send a transmission to modify the appearance of the negotiable instrument, thus effectively \u201cvoiding\u201d the physical negotiable instrument. A second date indicator is mounted to undergo intermittent rotation to display the tens place of the date.