Structures and methods for semiconductor integrated circuits with respect to heat dissipation are provided. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The magnetic write head further includes a magnetic circuit and the magnetic circuit includes a loop of magnetic material and a second coil disposed around the loop of magnetic material. A HEGA filter is downstream of the first outlet. The insulator can be prepared by crosslinking and curing a rubber composition comprising 100 parts by weight of a partially crosslinked butyl rubber and 50 to 200 parts by weight of an extender component.