A method for producing a component out of stacked plates soldered to one another, into at least some of which recesses are made, is proposed, in which at least one solder layer is provided between the plates for a solder diffusion process. The backup apparatus has a sequential data count setting unit, a sequential data information acquisition unit, and a reading unit. 60 and an Abbe’s number \u03bdCOM of not less than 20, and satisfies a relationship nCOMd\u22671. The method also includes cross-linking at least one region of the cross-linkable material by joining a first region of the cross-linkable material to a second region of the cross-linkable material to form a point of attachment.