A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. As a result, the component becomes symmetrically blocking and is suitable as a semiconductor switch e. When a processing time difference t is generated between the processing portions, by increasing or decreasing the feeding amount per unit time in a next step, the processing time difference is eliminated. The first mold portion and the second mold portion together define at least in part a mold cavity for molding a plastic container. According to the invention, there are edge strips running along the edges of the modules in which the wall sections of the individual modules are inserted using easily removable joint connections and through which adjoining modules can be connected and easily removed.