The invention provides a power semiconductor module including a power converter module with an improved configuration technology that minimizes or eliminates the need for a positive bonding connection between a power semiconductor element and a contact surface of a substrate. The camera unit includes an image sensor, an image signal processor, an application processor, and a multi-port memory. The plurality of types of optical adapters includes a predetermined observational optical system and is freely detachably attached to the distal section of the electronic endoscope.