Provided is a method for fabricating a semiconductor device. In the method, each of images to be processed is detected by a feature point detection method to detect a plurality of feature points. The structure thus formed is then coated with a photoresist layer 306. A second embodiment of a susceptor mounting assembly according to the invention also comprises a tower having an upper and lower end. The component M is at least one of Mg, Ti, and Ni. The polishing pad may have a window that includes an aperture in the backing layer aligned with a solid transparent portion in the polishing layer.