Provided are a thin film silicon wafer having high gettering capability, a manufacturing method therefor, a multi-layered silicon wafer formed by laminating the thin film silicon wafers, and a manufacturing method therefor. The case has a plurality of base apertures that extend into the bottom wall through a playing surface of the bottom wall and are positioned to represent bases of a baseball diamond. A further hollow shaft is coaxially provided on either the central or hollow transmission shafts and can be connected, via a shift device, to the central or hollow transmission shaft, and to which at least two further gearwheels of the gear stages are fixed. The drive shaft includes counterweights on both sides of the abrasive element, which may stabilize operation at high rotational speeds. Once the presence of the localized elevation is detected, calculations are performed using the topography measurements to determine whether the source of the localized elevation results from the chuck. Before a front end portion of a rollable material is engaged between the work rolls, the working oil pressure of the hydraulic cylinders is set at a high pressure value to make a pressing force on roll chocks high.