In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The indicator element has a saw tooth profile which co-operates with respective abutments on the plunger and a housing part of the device to control and energise indicator movement. The connective element includes a set screw and a receiving unit having an inclined surface. The pump is stopped when the pressure detected by the pressure detection means reaches a predetermined level. The system then processes the packet based on the received fields and the predicted field.