An apparatus according to one embodiment includes a near-field transducer positioned towards an air bearing surface side of the apparatus; and at least one conductor or circuit for causing heating of the near-field transducer. An inorganic protective film covering the thin-film capacitor element and having a second opening exposing at least a part of the conductive films is provided. The system may also include a first multiplier circuit that generates a first intermediate signal by multiplying the first and second logic levels of the digital signal by a first multiplier.