Within a method for forming a microelectronic fabrication, there is ion implanted into a corner of a topographic feature within a microelectronic substrate a dose of an implanting ion such as to effect rounding of the corner of the topographic feature when thermally oxidizing the microelectronic substrate. An outer surface of the elastomeric body extends between the first and second ends and has four generally planar sides, with each planar side of the outer surface being disposed to one side of and generally parallel to the longitudinal axis of the spring so as to reduce radial bulging of the spring in all directions when an axial load is applied to the spring. In addition, the conduit coupling and connector assembly of the present invention may be implemented using various alternate embodiments for either the locking rings or washers or for the housing member. A degree of selectivity at any excitation frequency is enabled for the dielectric sensing method from the manner in which the complex dielectric constant of a material affects the resonance pattern of the resonator with respect to shift in resonance frequency and the change in line width. Then, a second live-migration is executed on the second virtual machine in parallel with the ongoing first live migration.