A semiconductor integrated circuit device for communication is provided with a PLL circuit or the like formed therein, the PLL circuit which is capable of realizing the compensation of fluctuation due to temperature change, the inhibition of increase in the chip area and the ensurement of the performance margin, and which controls a VCO having multiple oscillation frequency bands. The shell is used to accommodate the support frame. The flow path comprises at least one throttling portion opening into the space of the body part, the cross-sectional flow area of the throttling portion being defined by the relative positions of the piston means and the body part. Once filled, surfaces of the PCB are coated with an organic solderability preservative. As a consequence, chemical means can then be used to remove the conducting material, thus undercutting and lifting-off that portion of the desired material deposited upon the substrate which is not included within the design pattern.