A semiconductor package in which solder balls can be loaded on an encapsulated resin to reduce the package area and a method for producing the semiconductor package. The method include drawing a single crystal of a shape memory alloy from a melt of the alloy. The transfer is then applied to a substrate by positioning a sheet of thermosetting hot melt film on the substrate; placing the transfer on the hot melt film with the flock in contact with the hot melt film; and applying heat and pressure. Thereby, the finishing grinding step just before the last steps of the both processing portions are simultaneously finished. The rate at which calls originating from the originating point code andor the calling number are admitted to the network may be adjusted based on the association between the call release messages and the originating point code andor the calling number.