In one aspect, the invention encompasses a semiconductor processing method of forming a material over an uneven surface topology. The resultant shaft bending moment is used to provide aircraft attitude control. Accordingly, such drills andor reamers may rotate and cut using a precessional pattern of motion. This contamination layer can be effectively removed in a non-destructive fashion by subjecting the wafer to a cleaning step. A fastener is located on the pole and is used to secure fencing material to the pole. The power supply with heat sink is assembled flexibly for saving space.