The present invention generally relates to the field of network communications, and more specifically to networks for crosstalk reductioncompensation and communication connectors which employ such networks. According to an example embodiment of the present invention, a metal bond pad is formed over circuitry in the semiconductor chip. The second guaranteed torque is set to a value greater than a lower limit value. It is an object of the present invention to provide a solution to the upstream data packet traffic congestion problem in transmission networks that comprises a PON system.