The present invention relates to a plate speaker, and more particularly, to a guide damper intended for a plate speaker and made of a flexible synthetic resin material. The wafer has a plurality of dies. Thus, in at least one embodiment, a droop control circuit imparts a droop-related offset between an output feedback signal and a reference signal responsive to a droop adjustment signal, and a response-enhancing amplifier circuit amplifies that offset for input to an error sensing circuit of a regulation control circuit. A determined violated move of the cells is rolled back and the overlap remover manager employed to remove overlaps between rolled back cells.