A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The crude solution may be a cell-free culture broth. Because of this, the layout areas of memories such as large-capacity DRAMs are optimized and their production cost can be reduced. To aid in allowing full coverage even during a change of active devices, when a transmitter and receiver are moved to a new time slot, the receiver is set to listen to both the old and the new time slots until the transmitter confirms that it has made the switch. These steps are repeated for any subsequent catalyst carrier, then product is removed from an outlet of the reactor.