A hydraulic circuit for a mobile handling device includes a lifting cylinder suitable for handling a variable load and an accumulator for recovering or recycling lowering load energy. In one embodiment, a system comprises a first application and an adapter interfaced with the first application. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy.