Methods and apparatus may augment the utility of an electrically powered vehicle. The hinge also includes a second flange having a second sleeve segment. A work piece to be bonded by the device comprises a top layer of transparent plastic and a base layer of absorbing plastic. More than two buffers can be used, and each of the buffers can have the same or a different decimation factor. The method further includes configuring the network device based on a response packet transmitted to the network device via the data link layer in response to discovering the network device. The mechanically ground bottom surface prevents heavy metals attached onto the bottom surface of the wafer from diffusing toward the sourcedrain regions of the semiconductor substrate and thereby from degrading the transistor characteristics.