A manufacturing process for a semiconductor-on-insulator structure having reduced electrical losses and which includes a support substrate made of silicon, an oxide layer and a thin layer of semiconductor material, and a polycrystalline silicon layer interleaved between the support substrate and the oxide layer. The container is formed from two panels. Methods of preparation and use are also provided. Light injected into the first structure is directed into the third structure where it is redirected so that it propagates out of the third structure uniformly and efficiently and in a direction that is substantially perpendicular to the surface of the third structure.