A twin-Vee-type dual band antenna includes interconnected first and second conductor arms and interconnected first and second mirroring conductor arms disposed on a substrate. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer.