This oxide sintered compact is obtained by mixing and sintering powders of zinc oxide, tin oxide and indium oxide. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. After generation, the electronic address is tested for validity. An LDD implantation is performed into the substrate to form LDD implants. Therefore, when the water bottle is installed on the water dispenser, a spigot adapter of the water dispenser is plugged into the water passage to break the sealing member at the breakable edge portion thereof while the retaining edge portion of the sealing member is remained to attach to the guiding channel. The auxiliary voltage generation circuit generates an auxiliary intermediate voltage that is coupled to a negative level shifting circuit to reduce the drain-source stress experienced by transistors in that circuit that are in an off state.