An optoelectronic module is provided which comprises a first semiconductor body with a radiation exit side on which an electrical connection region is arranged. The agents are dispensed via plungers with pistons within the compartments. The TAB is sent to the UE over a number of times so as to allow the UE to adjust the uplink transmission time based on a summed value of the TABs. The heat applicator device then applies heat to the next connector pin for soldering a next wire to the next connector with the process continuing until all of the wires are soldered to their corresponding connector pins on the electrical connector. The heat treated, coated ultrahard abrasive particles are further treated to convert the coats to an oxide, nitride, carbide, oxynitride, oxycarbide, or carbonitride thereof, or an elemental form thereof, or a glass.