Methods for forming STI structures in semiconductor devices are disclosed. Also, chromatic dispersion is compensated for by a chromatic dispersion compensator for an added wavelength of the wavelength-division multiplexing system. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. Dynamically building locale objects or subsections based on which locale objects were used in one or more previous executions saves time that would otherwise be required to build the locale objects when they are needed at run-time. The process involves the preparation of the novel intermediates of formula .