It is an object to reduce a thickness of a semiconductor component on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. Examples include CBF and CBV perfusion maps. Methods provided include producing a soybean plant by crossing soybean variety XR33Y10 with another soybean plant, methods for introgressing a transgenic, mutant trait, andor native trait into soybean variety XR33Y10, methods for producing other soybean varieties or plant parts derived from soybean variety XR33Y10.