A stack of semiconductor dies is disclosed. The heat exchanger includes a first tube made from a steel alloy which is alloyed to facilitate bending, the first tube having a first end connected to the outlet of an evaporator and a second tube having a first end connected to the inlet of the evaporator. A first switch is connected to the incoming line and to the protection ring, a second switch is connected to the outgoing line and to the protection ring, and a third switch is connected to the protection ring and to the incoming and to the outgoing lines, for re-routing traffic. When the cores of the coring system are joined together by the connecting arrangement and placed in a mold, molten metal may be introduced to the mold at the joined area of the two core pieces to form a one-piece flash-free connector body according to the present invention.