A semiconductor device comprises a carrier. The improved mounting cup comprises a peripheral rim located in proximity to an outer periphery of the mounting cup for sealing the mounting cup to the aerosol container. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface. The protruding portion has a restricting portion that is engaged with the cutout portion in a rotation direction so as to restrict rotation of the intermediate element relative to the output element, and a support portion that is engaged with the cutout portion so that the intermediate element is supported by the output element in a radial direction. A grommet is disposed in the aperture and extends through the body panel into the interior vehicle space.