An apparatus and method for heating materials or substances in an oven at an oven temperature below their melting andor vaporization points to either melt andor vaporize the substance. The present invention only utilizes a gate line shorting bar to short all gate lines and utilizes a data line shorting bar to short all data lines, in order to greatly avoid the abnormal discharge of the plasma generated when the hole is formed cause static damage to the metal overlapping traces of the shorting bar. The 5 ESTs may also be used in diagnostic, forensic, gene therapy, and chromosome mapping procedures. A portion of the dielectric layer is removed to expose a first sidewall of the silicon-containing conductive layer.