A semiconductor device includes an interconnection structure in which via-plug density is higher in an upper layer part than a lower layer part, wherein the peeling of the lower via-plugs at the time of formation of the upper-via-plugs is avoided by restricting the density of the upper s, defined for a unit area having a size of 50-100 \u03bcm for each edge, to be 60% or less. In one embodiment of the invention, a network element acting as a source of the LSP receives a request to compute the LSP which includes one or more traffic engineering constraints. A broadcast receiver receives an interactive application, stores the included retirement instructions, and executes the interactive application concurrently with the display of an associated television program. One end of the first radiating element is vertically connected to one end of the commnon ground element and the other end of the first radiating element is open. 12 mum even after repeating the SC-1.