The present invention relates to a fast uplink ranging system and method in a mobile communication system. The detector includes a housing which is provided with a first series of passages for fixing screws, whereby the axes thereof are perpendicular to a large surface of the housing for fixation on top of the surface of a support. Or, the protective film is provided on the second semiconductor multi-layered film reflection mirror so that the contact electrode is superimposed on the surface of the protective film, and the opening is formed on the protective layer. The method includes moving the first drive element off a second side of the threshold, opposite to the first side of the threshold, and moving the third drive element onto the threshold, placing both the second and third drive elements on the threshold. In addition, the semiconductor wafer is also characterized in that the reference mark is located at least one of the vertices of a virtual rectangle covering the plurality of chip regions, and in that the reference mark is longer than one side of each of the chip regions.