A water-soluble substrate, and more particularly a water-soluble substrate that is resistant to contact with small amounts of water, and methods of making the same are disclosed. In a further aspect of the present invention, access to the pads of integrated circuits on a wafer is additionally provided by contact terminals in a second inquiry area located on the wafer-side of the edge-extended wafer translator in a region thereof bounded by its outer circumference and the circumference of the attached wafer. The back contact provides improved reflectance particularly for infrared wavelengths while still maintaining ohmic contact to the semiconductor absorber. A high voltage regulator output circuit is connected to the supply regulator to receive high voltage signals therefrom. Conductive material is subsequently formed to electrically connect exposed substrate areas with associated conductive portions of individual bit lines.