A method is described that involves sending a positive imposter response as a consequence of a status request message having been received. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. A closed loop feedback control system can be provided for receiving the signal from the encoder reader, and for generating an output signal in response to the signal from the encoder reader in accordance with a program stored in memory. Additional embodiments are disclosed. The rapidly-flowing cleaning fluid removes the particles andor films from the substrate while preventing dropping of the removed particles or re-deposition of the film back onto the substrate.