A semiconductor chip package is disclosed. The device includes a face mask including a support frame and an adjustable head strap connected to the support frame. A control unit estimates the frequency error and provides a frequency error estimate. The connecting base has male threads on an outer surface and an arcuate surface at the top inner wall to be engaged with the adjusting rod. The protective system has a nickel-base superalloy bond coat, an aluminide layer overlying and contacting the bond coat, and a dense vertically microcracked ceramic thermal barrier coating overlying and contacting the aluminide layer.