A semiconductor structure comprises a metal gate structure formed in a substrate, wherein the metal gate structure comprises a first film formed of a first material and formed on a bottom and sidewalls of a gate trench, a second film formed of a second material and formed over the first film and a gate electrode formed over the second film. Initially, IO pins on a package are subdivided into those that will also remain powered up and those that will power down during idle state. To achieve such data delivery, both the origin and each delivery site execute site connection-manager software that allows the origin and the intended destinations to create the needed connections to facilitate data delivery and the network switches execute a network connection manager. Further, a specific screen color is displayed on a display section 20.