According to one exemplary embodiment, a structure situated in a semiconductor die comprises an active shield situated in a substrate, where the active shield comprises a salicide layer situated on an active region, and where the active shield has a first conductivity type. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase. The multi-resolution images may also be compressed. The resulting radiation may be detected. The write voltage applying circuit applies a write compensating voltage, which has a polarity opposite to that of the voltage applied on the both ends of the unselected memory cells other than the selected memory cell, on both ends of the unselected memory cells, while the write voltage is applied to the selected memory cell. Further, a Zener diode 21 is coupled across the switching element 2 with reverse polarity to the switching element 2.