Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. In one embodiment, a plurality of pieces are coupled together and to a housing, and have one or more wires running through at least a first piece and a second piece of the plurality of pieces. Upon determining an acceptable contact condition, the target zone is irradiated or otherwise heated for a finite time period with energy. A webbing path adapter has a passageway for receiving seat belt webbing. A tubular part of the hosel portion into which a club shaft is inserted is formed integrally with the metal component or separately from the metal component and the resin component. In one embodiment, an electrical interconnect via structure uses a dielectric or high resistivity diffusion barrier material.