The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The original dielectric layer is maintained such that the semiconductordielectric interface remains unchanged. In one embodiment, a self-contained dithering module includes a diplexer that provides an insertion loss associated with the noise signal of 3 dB or less. The furnace includes flow rate-controlling partitions, arranged therein, for controlling the flow of furnace gas and the furnace gas in the cooling step is allowed to flow in the direction of the movement of the hearth with the partitions.