A semiconductor bridge die may have an \u201cH-design\u201d or \u201ctrapezoidal\u201d configuration in which a center bridge segment is flanked by one or more angled walls on each side of the bridge segment. The pair of electrodes are operable to pass a current through a laminated body including the first and second magnetic layers, the nonmagnetic layer, and the third magnetic layer. A connection block is fixed on the housing rearward of the piston. A strip-form body surrounds and integrates the inflator side mounting portion and the inflator disposed in the inflator insertion portion. The bottom photodiode has a bottom p doped layer overlying the substrate and a bottom n doped layer cathode overlying the bottom p doped layer. Thus the present technique can be used without requiring software drivers to be rewritten.