A semiconductor device includes a substrate; a first nitride semiconductor layer provided over the substrate and having a nitride-polar surface; a gate electrode provided over the first nitride semiconductor layer; and a semiconductor layer provided on the first nitride semiconductor layer and only under the gate electrode, and exhibiting a polarization. The interconnect to be cut comprises: a first orientation film which contains copper as a main component and is oriented in a plane; and a second orientation film which contains copper as a main component and is oriented in a plane. In one embodiment, each bank includes data from one cache way. When the drill passes through the part, it does not damage the tool because the recess accommodates. Finally, the first and second images are stitched into a complete image. The staggered cleaning unit configuration in combination with component positioning provides substantially unhindered access to move the staggered printheads into and out of the service station.