A memory module assembly includes a printed circuit board having a main heat-generating electronic component thereon, first and second heat sinks, attached on opposite sides of the printed circuit board and a clamp clamping the first, second heat sinks and the printed circuit board together. The assembled manifold includes exhaust tubes in communication with the combustion chambers of the engine and a collector chamber for directing exhaust from the tubes to the exhaust system. The p type strained layer has a thickness adjusted to be thicker than the critical film thickness at which no misfit dislocation occurs. A current mobile telephone location is determined by a mobile location technology.