A chip package assembly is produced by preparing a transparent substrate in advance, a chip is electrically connected to a circuit layout of the transparent substrate. A first electrical contact is positioned on the current spreading region and a second electrical contact is positioned to conduct electrical current in circuit with the first electrical contact through the current path. The sterilization port may include an ultraviolet light source capable of irradiating the tube set connector with ultraviolet radiation when the tube set connector is disposed within the sterilization port. The conformal silicon oxide thin film formed by the method can be applied in structures of various devices in refined processes. Preferably, the disk holding mechanism enters the center hole downwards and holds the disk on a lower side. The shows to be recorded may also have a predefined format which may be used to ease playback of recorded programming by allowing the user to easily locate and playback sections of programming of interest.