The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50 C. The assembly may also include a backplane glass comprising ion-exchangeable glass having a device surface, an underside and a second coefficient of thermal expansion CTE2, wherein CTE2 is within +\u221215. The arm includes a first segment pivotally attached to a gas spring and a second segment contacting the vehicle closure member. A second endoscope is then inserted into the overtube to make a distal end portion of its insertion tube protrude from the distal end of the overtube and is located adjacently to the Vater’s papilla. Methods for making the same are also disclosed.