A computerized system and method for large scale semi-supervised learning is provided. A separate, electrically conductive compensation coating may be provided in each contact carrier part, each having a connection surface for producing an electrically conductive connection to an associated contact. Each external lead of an upper semiconductor package has a U-shaped cut end when package singulation. In a further embodiment, the end cap can include a tensioning mechanism integral with a front edge of the end cap. The apparatus can include, for example, a biomicroscope, an illuminating light source and a high speed camera to acquire the series of temporal images with the data then analyzed by a programmed processor. The key provides wireless transmission of power with simultaneous transfer of data.