A recordable optical disc is provided with: a disc substrate ; a record track formed on the disc substrate spirally or coaxially around a center of the disc substrate; and an emboss pit formed in a predetermined zone on the disc substrate in correlation with predetermined data, which is recorded on the record track in the predetermined zone. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. 01 to 5 parts by weight relative to 100 parts by weight of the alkyl acrylate ; 0.