A semiconductor device comprising a semiconductor chip having an active and a passive surface, the passive surface adhesively attached to a substrate film by means of a multilayer composite; this composite comprising a metal foil having first and second surfaces and an adhesive layer attached on each of these surfaces. A ventilator tube is connected to the endotracheal tube and provided therein with a microphone to sense a breath sound transmitted via the endotracheal tube and a pressure sensing element to measure a circuit pressure in the ventilator circuit for the endotracheal tube. The cylindrical wall includes an inner liner and an outer liner concentric to the inner liner.