The present invention relates to a punching tool for providing a hole or a dimple in a metal casing in a borehole. It is particularly though not necessarily applicable to forming a dual-damascene interconnect structure by a counterbore process, in which a deep via is etched prior to the formation of a trench connecting two of more vias. The receiver enables or disables the equalizer accordingly. The second two-wire interface component is further configured to use one or more of the data fields from the payload portion of the first two-wire interface communication in the header portion of the second two-wire interface communication.