A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. One embodiment includes data traffic offload techniques managed by a Radio Resource Control in a networked device including offloading data at the IP, PDCP, RLC, or MAC layers; another embodiment includes data traffic offload techniques managed by a MAC Scheduler with RRC control. These methods involve the administration of liposome-encapsulated vinca alkaloids, e. Each snap-on component includes a U-shaped border, a tab, and at least one Y-shaped resisting member.