System and computer program product for automatically adjusting allocation of processing power in a server. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Immersion exposure is performed by permitting the exposure light beam to excellently reach an image plane via the projection optical system and the liquid.