A swing frame includes a pair of support frame units, a hollow horizontal bar, and two primary locking devices. The irradiation light includes coating light that coats the irradiation target object, and background light that becomes a background of the irradiation target object. Each of the recesses is sized and configured to receive a respective one of the contact elements. u here represents the linear velocity of the dimethylnaphthalene isomer mixture supplied to an adsorption column, represents the packing density of Y-type zeolite, and d represents the grain size of the Y-type zeolite. The signal conductive layer carries at least one solder pad portion, wherein both a size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced such that the solder pad to a ground, and solder on the solder pad to adjacent solder on adjacent pads, capacitance are reduced providing low signal reflection losses and a decrease in cross-talk. The method includes: converting header names into canonical form, wherein a canonical key represents at least one equivalent header name, and wherein a canonical key has a string and an integer value; providing a mapping between the header names and the canonical keys; and searching for a header name using the canonical key by sequential search using integer comparison.