Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields. The process for preparing the SSZ-2633 family of zeolites involves using a structure directing agent selected from the group consisting of 1,5-bispentane dications, 1,4-bisbutane dications and 1,4-bisbutane dications. Also provided by the invention are tissue cultures of the soybean variety D4789254 and the plants regenerated therefrom.